Bridging faults and IDDQ testing

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IEEE Computer Society Press , Los Alamitos, Calif
Metal oxide semiconductors, Complementary -- Testing -- Data processing., Iddq tes
Statement[edited] by Yashwant K. Malaiya and Rochit Rajsuman.
SeriesIEEE Computer Society Press technology series
ContributionsMalaiya, Yashwant K., Rajsuman, Rochit., IEEE Computer Society. Test Technology Technical Committee.
Classifications
LC ClassificationsTK7871.99.M44 B75 1992
The Physical Object
Paginationvi, 128 p. :
ID Numbers
Open LibraryOL1726830M
ISBN 100818632151, 081863216X
LC Control Number92030950

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IDDQ testing Bridging & Stuck-on Faults Logic monitoring is inadequate. logic 0: 0V logic 1: 5V 0 1 V 0 or 1.

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0 or 1. IDDQ testing Line Break Faults 5V 5V Induce large current A floating node may drift to V~V and hence may turn on both PMOS and NMOS transistors. IDDQ testingFile Size: KB. Chakravarty and M.

Liu, “Algorithms for I DDQ measurement based diagnosis of bridging faults” J. of Electronic Testing: Theory and Applications (JETTA), vol. 3, no. 4, pp. –, December Cited by: This paper presents an ATPG framework for IDDQ testing of both intra- and inter-gate bridging faults.

The framework integrates random simulation and a deterministic stage using Boolean SATisfiability (SAT) as the underlying engine. This decides whether a fault is testable or untestable. In this way, we conduct an exact search for test patterns for IDDQ testing of both intra- and inter-gate.

The types of potential problems detected by Iddq include: • Process flaws: bridging, deformed traces, mask problems, incomplete etching, logically redundant defects.

• Design flaws: Floating gates, logic contention, mask generation errors. Why doesn’t Iddq replace Function. Iddq is intended to complement and not replace function for File Size: KB. Stuck-at Fault Model.

The single stuck-at fault (SSF) model assumes that there is just one fault in the logic we are use a single stuck-at fault model because a multiple stuck-at fault model that could handle several faults in the logic at the same time is too complicated to implement.

We hope that any multiple faults are caught by single stuck-at fault tests [Agarwal and. Iddq Testing for CMOS VLSI Rochit Rajsuman, SENIOR MEMBER, IEEE It is little more than years since the idea of Iddq testing was and [3] for the detection of bridging faults. Around the same time, researchers at IBM also proposed the monitoring of switching current to.

He has co-edited the IEEECS Tech. Series books ``Software Reliability Models, Theoretical Developments, Evaluation and Applications'' and ``Bridging Faults and IDDQ Testing''. He was a guest editor of special issues of IEEE Software and IEEE Design & Test. In a previous work on test generation for IDDQ bridging faults in CMOS circuits, a genetic algorithm (GA) based approach targeting the all-pair bridging fault set stored in a compact-list data structure was used.

In this paper, we target a reduced fault set, such as the one extracted from circuit layout.

Description Bridging faults and IDDQ testing PDF

of test generation is to activate the fault. IDDQ test can detect many other kinds of faults, which cannot be detected with a standard functional or structural test, based on a stuck-at fault model. IDDQ test is the only way to detect the following faults and defects: bridging faults, gate oxide defects, gate leakage within a transistor, shorts.

We consider external bridging faults and internal bridging faults as a target fault. Test generation for external bridging faults consists of three phases as (1) use of weighted random vectors, (2. Iddq testing is a method for testing CMOS integrated circuits for the presence of manufacturing faults.

It relies on measuring the supply current (Idd) in the quiescent state (when the circuit is not switching and inputs are held at static values). The current consumed in the state is commonly called Iddq for Idd (quiescent) and hence the name. Home Conferences ASPDAC Proceedings ASP-DAC '00 Fault models and test generation for IDDQ testing: embedded tutorial ARTICLE Fault models and test generation for IDDQ testing.

In this paper we give an overview of recent work in extraction, simulation, and IDDQ test generation for bridging faults (BFs) in digital VLSI circuits.

Details Bridging faults and IDDQ testing FB2

We then show how these techniques can be. Abstract. I DDQ testing with precision measurement unit (PMU) was used to eliminate early life failures caused by CMOS digital ASICs in our products.

Failure analysis of the rejected parts found that bridging faults caused by particles were not detected in incoming tests created by automatic test generation (ATG) for stuck-at-faults (SAF). Introduction: Physical Defects and Bridging Faults in CMOS ICs --Ch.

Introduction to Current Testing --Ch. Test Generation for Iddq Testing --Ch. Use of Iddq Testing in IC Production Lines --Ch. Current-Sensing Techniques --Ch. Case Studies With Iddq Testing --Ch. Summary and Suggestions. Series Title. Chapter IDDQ TEST VOUT VDD Rb VIN Va Cmp S1 S3 Vc S2 S4 Cpb VMET VDD IDDQ IDDQ Vb IDDQ S5 Floating R b P1 P2 P3 N3 Path from N1 N2 VMET 2 fault gate Path for current leakage for S1 power to ground GOS defect Figure Circuit illustrating oating gate GOS leak age and bridging faults tunneling This causes a dela y fault and elev ation of I.

supply voltage bump test and IDDQ test by using the ADVANTEST T test By reading the book Essentials of Electronic Testing that written by Dr. Michael Bushnell and Dr. Vishwani Agrawal, I acquired a lot of Since there are many types of defects, such as bridging faults and stuck-at faults, that need to be detected, a number of di.

Design and test rules for CMOS circuits to facilitate IDDQ testing of bridging faults Abstract: All possible bridging faults (BFs) between any two circuit nodes are considered, where a circuit node may be the drain, source, or gate terminal of a transistor. IDDQ Testing: A Review.- Iddq Testing as a Component of a Test Suite: The Need for Several Fault Coverage Metrics.- Iddq Testing in CMOS Digital ASICs.- Reliability Benefits of IDDQ.- Quiescent Current Analysis and Experimentation of Defective CMOS Circuits.- QUIETEST: A Methodology for Selecting IDDQ Test Vectors.- Generation and Evaluation of.

Using an Iddq test methodology on circuits with dynamic logic tends to be problematic, mainly due to charge leakage related problems. A new Design for current Testability (DcT) method has been developed, which overcomes these problems by switching the circuit into a static mode during test.

The method referred to as clock switching is applicable to both domino logic and True Single-Phase Clock. By this definition, all CMOS circuits are % IDDQ testable. Faults detected by I DDQ tests: Bridging Faults: Shorts between two nodes causing.

IDDQ testing is a cost effective test strategy for digital CMOS ICs with the voltage on the circuit s output pins) and/or IDDQ Test Sets (the ATE stimulates VLSI. Xerox. Yamaha. The value of Iddq testing is that many types of faults can be detected with very few patterns.

The drawback is the additional test time to perform the current measurements. Toggle Test Toggle fault testing ensures that a node can be driven to both a logical 0 and a logical 1 value, and indicates the extent of your control over circuit nodes. A method of enhancing the testability of CMOS ICs, in one or more of the following ways: by minimizing performance degradation of CMOS ICs under test; by eliminating the need for external voltage and current references; by inducing responsive effects; and by minimizing the amount of space used to integrate on-chip testing devices.

The device is a CMOS IC comprising a fixed supply voltage, a. Abstract: This paper presents a static test compaction method for IDDQ testing of sequential circuits.

Target faults are bridging faults between arbitrary pair of nodes including internal nodes, signal lines, VDD and GND. In the proposed method, test subsequences are. A test point insertion procedure that targets both single stuck-at faults and non-feedback bridging faults is presented.

It is shown that by considering both types of faults when selecting the location for test points, higher fault coverage can be obtained with little or no increase in overhead.

He served as the General Chair of and IEEE International Symposium on Software Reliability Engineering (ISSRE). He co-edited the IEEECS Technology Series books "Software Reliability Models, Theoretical Developments, Evaluation and Applications" and "Bridging Faults and IDDQ Testing".

Fall CSCE/ECEN Testing and Diagnosis of Digital Systems. Fall CSCE Software Engineering. Fall CSCE Seminar. Spring CSCE Computer Organization.

RESEARCH INTERESTS. Integrated Circuit Test; Defect-Based Test; Delay Test; IDDQ Test and Outlier Analysis; Fault Diagnosis; Realistic Fault Modeling. IDDQ is the IEEE symbol for Direct Drain Quiescent Current and IDDQ Testing measures this current to discriminate between a good and a defective chip.

But how could current be used to detect a fault. Read on!DDQ testing is gaining popularity among DFX (DFT, DFV, DFM etc condensed into DFX) engineers because it's cost effective and can detect faults which might be left undetected by traditional.

Extensive fault model support, including stuck-at, IDDQ, transition, path delay, and bridge. On-chip PLL support for accurate at-speed test. Ensures the highest performance ATPG for full and structured partial scan designs. Reduces run time with no effect on coverage or pattern count using distributed ATPG.

For instance, the use of the fault-free next-state function for sequential IDDQ fault simulation is shown to result in a wrong classification of some resistive short defects. This is the first systematic study of IDDQ testing of resistive short defects.

The impact of the threshold on .Vlsi Design Verification and Testing Lecture14 - Free download as Powerpoint Presentation .ppt), PDF File .pdf), Text File .txt) or view presentation slides online. verification soc.

Microprc, cessing and fvlicroprogramming 35 () North-Holland CMOS Transistor Faults and Bridging Yaul~: Testability by Delay Effects and Overcm'reats U. Hfibner, W. Meyer, H. T. Vierhaus GMD/SET, P. O. BoxW-$ SL Augnstin, Germany Testing CMOS circuits for faults which cannot safely he detected by ~ test patten~ has been a matter of intense .